Testbed for thermal and performance analysis in MPSoC systems
Michal Sojka, Ondřej Benedikt, Zdeněk Hanzálek, Pavel Zaykov
DOI: http://dx.doi.org/10.15439/2020F174
Citation: Proceedings of the 2020 Federated Conference on Computer Science and Information Systems, M. Ganzha, L. Maciaszek, M. Paprzycki (eds). ACSIS, Vol. 21, pages 683–692 (2020)
Abstract. Many modern computing platforms in the safety-critical domains are based on heterogeneous Multiprocessor System-on-Chip (MPSoC). Such computing platforms are expected to guarantee high-performance within a strict thermal envelope. This paper introduces a testbed for thermal and performance analysis. The testbed allows the users to develop advanced scheduling and resource allocation techniques aiming at finding an optimal trade-off between the peak temperature and the achieved performance. This paper presents a new, open-source Thermobench tool for data collection and analysis of user-defined workloads. Furthermore, a methodology for shortening the time needed for the data collection is proposed. Experiments show that a significant amount of time can be saved. Specifically, time reduction from 60 minutes to 15 minutes is achieved with the i.MX8 MPSoC from NXP while running a set of user-defined benchmarks that stress CPU, GPU, and different levels of the memory hierarchy.
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